IEMT 2008     

CONFERENCE KEYNOTES:

1.                  Opening Speech.

                        Instructor :        Dr. Bill Chen
                                                IEEE CPMT President

2.                  Computing Application Trend And Its New Packaging And Manufacturing Challenges. 

                        Instructor :        Dr. Raj Master
                                                Advanced Micro Devices (AMD), USA

3.                  Technology Trends for Heterogeneous Integration. 

                        Instructor :        Dr. Rolf Aschenbrenner
                                                Fraunhofer Institute, IZM

4.                  Semiconductor Packaging Advances and Trend. 

                        Instructor :        YK Sow
                                                Intel Technology, MALAYSIA

5.                  Redistributed Chip Packaging. 

                        Instructor :        Dr. Karl Johnson
                                                Freescale Semiconductor, USA

6.                  Automotive Market Trend And Its Challenges on Package Reliability. 

                        Instructor :        Dr. Mervi Poulasto
                                                Infineon Technology, GERMANY

SHORT COURSE ON 4th NOVEMBER 2008 (1 FULL DAY)

MORNING SHORT COURSE (8:15 AM – 12:15 PM)

1.                  Thermal Management of IC Packages Part I. 

                        Instructor :        Prof. Dr. Kankanhalli Seetharamu
                                                PES Institute of Technology, INDIA

2.         Through Silicon Vias And Microvias For High Density Interconnect in Advanced Packaging. 

                        Instructor :        Prof. Dr. Ricky Lee
                                                Hong Kong University of Science and Technology, HONG KONG

3.         Wafer Level Chip Scale Packaging Part I. 

                        Instructor :        Luu Nguyen
                                                National Semiconductor Corporation, USA

AFTERNOON SHORT COURSE (1:30 PM – 5:30 PM)

1.                  Thermal Management of IC Packages Part II.

                        Instructor :        Prof. Dr. Kankanhalli Seetharamu
                                                PES Institute of Technology, INDIA

2.         3D Packaging Technology And Advances. 

                        Instructor :        Shimamoto Haruo
                                                Renesas Technology Corporation, JAPAN 

3.         Wafer Level Chip Scale Packaging Part II. 

                        Instructor :        Luu Nguyen
                                                National Semiconductor Corporation, USA